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Wafer De-taping Film / Remove Tape
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Product Strcture
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Product Description
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| Classification | Unit | Typical values | Remark (기준) | ||||
| Base Film thickness | UM | 50< | - | ||||
| Total thickness | pi | 100 | 100±5 | ||||
| Tensile strength | kg/mm | 8 | 8< | ||||
| Elongation | % | 130 | 100< | ||||
| Adhhesive strength | gf/25mm | 2200 | 1900< | ||||
| Size | Width | mm | 50 | (-) 0.5 ~ + 0.5 | |||
| Length | M | 200 | (-) 0 ~ + 1 | ||||
| Joint | Time | 0 | 0 ~ 1 | ||||
| Heat seal temperature | ℃ | 235 |
| Heat seal Pressure | kg/cm2 | 1 ~ 3 |
| Heat seal Time | sec | 1 ~ 3 |
Wafer De-taping Film / Remove Tape
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Product Strcture
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Product Description
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| ITEM | EL-85 | Remark | ||
| Size(mm) | 50mm*100m< | |||
| Thickness(㎛) | Face material | Polyester / 50 | Material / Thickness | |
| Adhesive layer | SPECIAL ACRYLIC / 35 | Material / Thickness | ||
| Adhesion (gf/25mm) | RT | 2200 | conforms JIS Z 0237(1) | |
| 25% strensth (N/10mm) | MD | 58 | conforms JIS C 2318(2) | |
| CD | 70 | |||
| Tensile Strength (Mpa) | MD | 125 | ||
| CD | 124 | |||
| Elongation (%) | MD | 126 | ||
| CD | 119 | |||