MBS KOREA

ESG of MBS KOREA
for Sustainable Growth

ESG is recognized as a non-financial performance indicator directly linked to a company's long-term value creation and market competitiveness, going beyond simple ethical management. MBS KOREA realizes a sustainable future and secures the trust of stakeholders, including customers, investors, and employees, through environmental protection, social responsibility fulfillment, and the establishment of transparent governance.

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Home > PRODUCT > FILM
FILM

MBS-100R (Heat adhesion Film)

Wafer De-taping Film / Remove Tape

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Product Strcture

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Product Description

  • The EL-100R product is a powerful heat-adhesion type composite film that provides strong adhesion to remove
    protective films attached to Glass, Window, LCD, and wafer.
  • MBS-100R (Heat Adhesion Film) LintecMS-75C Alternative Application [Applied Backgrinding Tape - Ninteci E E-8180HR / E-3125KN]

Technical Date & Quality

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Classification Unit Typical values Remark (standard)
Base Film thickness UM 50< -
Total thickness pi 100 100±5
Tensile strength kg/mm 8 8<
Elongation % 130 100<
Adhhesive strength gf/25mm 2200 1900<
Size Width mm 50 (-) 0.5 ~ + 0.5
Length M 200 (-) 0 ~ + 1
Joint Time 0 0 ~ 1
Heat seal temperature ℃ 235
Heat seal Pressure kg/cm2 1 ~ 3
Heat seal Time sec 1 ~ 3

EL-85 (De-taping Film)

Wafer De-taping Film / Remove Tape

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Product Strcture

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Product Description

  • The el-100r product is a powerful heat adhesion type composite film that removes protective
    films attached to glass, window, lcd, wafers, etc. It provides strong adhesion for use.
  • Nitto Denko BT-315, TAPEX BR-350A Replacement

Technical Date & Quality

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ITEM EL-85 Remark
Size(mm) 50mm*100m<
Thickness(㎛) Face material Polyester / 50 Material / Thickness
Adhesive layer SPECIAL ACRYLIC / 35 Material / Thickness
Adhesion (gf/25mm) RT 2200 conforms JIS Z 0237(1)
25% strensth (N/10mm) MD 58 conforms JIS C 2318(2)
CD 70
Tensile Strength (Mpa) MD 125
CD 124
Elongation (%) MD 126
CD 119
  • (1) JIS Z 0237： Peeling speed = 300mm/min, Peeling angle = 180 deg. Substrate = # 304 -SUS - plate
  • (2) JIS Z 2318： Peeling speed = 300mm/min, Sample size ； xl5mmxl00mm
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