MBS KOREA

FILM

MBS-100R (Heat adhesion Film)

Wafer De-taping Film / Remove Tape

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Product Strcture

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Product Description

The EL-100R product is a powerful heat-adhesion type composite film that provides strong adhesion to remove
protective films attached to Glass, Window, LCD, and wafer.
MBS-100R (Heat Adhesion Film) LintecMS-75C Alternative Application [Applied Backgrinding Tape - Ninteci E E-8180HR / E-3125KN]

Technical Date & Quality

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Classification		Unit	Typical values	Remark (standard)
Base Film thickness		UM	50<	-
Total thickness		pi	100	100±5
Tensile strength		kg/mm	8	8<
Elongation		%	130	100<
Adhhesive strength		gf/25mm	2200	1900<
Size	Width	mm	50	(-) 0.5 ~ + 0.5
Size	Length	M	200	(-) 0 ~ + 1
Joint		Time	0	0 ~ 1

Heat seal temperature	℃	235
Heat seal Pressure	kg/cm2	1 ~ 3
Heat seal Time	sec	1 ~ 3

EL-85 (De-taping Film)

Wafer De-taping Film / Remove Tape

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Product Strcture

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Product Description

The el-100r product is a powerful heat adhesion type composite film that removes protective
films attached to glass, window, lcd, wafers, etc. It provides strong adhesion for use.
Nitto Denko BT-315, TAPEX BR-350A Replacement

Technical Date & Quality

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ITEM		EL-85	Remark
Size(mm)		50mm*100m<
Thickness(㎛)	Face material	Polyester / 50	Material / Thickness
Thickness(㎛)	Adhesive layer	SPECIAL ACRYLIC / 35	Material / Thickness
Adhesion (gf/25mm)	RT	2200	conforms JIS Z 0237(1)
25% strensth (N/10mm)	MD	58	conforms JIS C 2318(2)
25% strensth (N/10mm)	CD	70
Tensile Strength (Mpa)	MD	125
Tensile Strength (Mpa)	CD	124
Elongation (%)	MD	126
Elongation (%)	CD	119

(1) JIS Z 0237： Peeling speed = 300mm/min, Peeling angle = 180 deg. Substrate = # 304 -SUS - plate
(2) JIS Z 2318： Peeling speed = 300mm/min, Sample size ； xl5mmxl00mm